We are seeking a highly skilled and experienced Thermal Management Engineer to join our team, focusing on the development of advanced thermal management solutions for consumer electronics. The ideal candidate will have over 5 years of experience in designing and implementing innovative thermal solutions. Expertise in chip-level cooling, phase change materials (PCM), electrowetting, and other cutting-edge technologies. In this role, you will contribute to the development of high-impact technologies, collaborate with cross-functional teams, and help expand our intellectual property portfolio.

Key Responsibilities:

• Thermal Solution Development: Design and optimize thermal management systems for consumer electronics and HPC applications, utilizing advanced technologies such as chip-level cooling, vapor chambers, electrowetting, electrocaloric cooling, etc.
• Research and Innovation: Contribute to the generation of innovative ideas, participate in research efforts, and support the development of patentable technologies to strengthen the company’s position in the field.
• Simulation and Testing: Perform detailed thermal simulations and experimental validations to ensure the performance and reliability of thermal designs.
• Cross-functional Collaboration: Work closely with R&D, product design, and engineering teams to integrate thermal solutions into products, ensuring compliance with performance requirements and design constraints.
• Continuous Improvement: Stay informed about emerging thermal management technologies, materials, and methods, and actively incorporate these advancements into project work.
• Documentation and Reporting: Prepare technical documentation, reports, and presentations to communicate findings and progress effectively. Filling patents.

Qualifications:

• Education: PhD in Thermal Engineering, Mechanical Engineering, Material Science, or a closely related field.
• Experience: At least 5 years of relevant experience in thermal management for consumer electronics, HPC, or related industries.
• Technical Expertise:
• Strong understanding of heat and mass transfer principles.
• Proficiency in advanced cooling technologies such as chip-level cooling, vapor chambers, phase change materials (PCM), and electrowetting.
• Experience with PCM fabrication, encapsulation, and lamination techniques.
• Problem-Solving Skills: Demonstrated ability to tackle complex technical challenges and propose innovative solutions.
• Collaboration: Strong interpersonal skills and the ability to work effectively within a multidisciplinary team.

About Huawei:

Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have 207,000 employees and operate in over 170 countries and regions, serving more than three billion people around the world. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world. Scientific exploration and technological innovation drive civilization and society forward. Huawei understands the importance of research and innovation and how openness is critical for both. We are ready and willing to work with academia and industry to explore the frontiers of science and technology, push innovation forward, create value for industry and society as a whole, and build a better intelligent world. Learn More about Huawei.