The Thermal Management Group in the Helsinki Hardware and System Lab at the Huawei Finland Research Center develops innovative solutions to address thermal challenges in advanced electronic devices.
We are an R&D-focused team exploring advanced materials, device concepts, and cooling solutions for next-generation applications. Our work covers materials processing, device integration, prototype development, and experimental characterization. We are looking for a motivated intern eager to contribute to innovative research in a collaborative and international environment.

Role Overview
The intern will support projects related to thermal-management materials and solution development for compact electronic devices. The work will include hands-on laboratory experiments, material preparation, prototype testing, data analysis, literature review, and technical reporting.
The role is suitable for a Master or PhD student or early-career researcher with a background in materials science, chemistry, chemical engineering, mechanical engineering, thermal engineering, applied physics, or a related field.

Key Responsibilities
• Support the development and testing of new thermal-management materials, structures, and cooling concepts.
• Contribute to thermal design and analysis of electronic devices and systems.
• Assist in materials preparation, processing, encapsulation, and sample fabrication.
• Support the design, assembly, and performance evaluation of experimental prototypes.
• Perform laboratory testing and characterization of materials and cooling demonstrators.
• Operate and analyze results from thermal, mechanical, and analytical characterization equipment, such as DMA, TGA, thermal cameras, sensors, data-acquisition systems, and environmental/test chambers.
• Collect, organize, and analyze experimental data related to temperature response, heat transfer, mass transfer, material stability, reliability, and prototype performance.
• Support work related to solid-state cooling, single-phase cooling, and two-phase cooling concepts.
• Conduct literature reviews, prepare technical documentation, and contribute to internal project reports and presentations.
• Collaborate with team members to support ongoing project milestones.

Qualifications
• Currently pursuing a PhD in Materials Science, Chemistry, Chemical Engineering, Mechanical Engineering, Thermal Engineering, Applied Physics, or a related field.
• Strong understanding of thermodynamics, heat transfer, and mass transfer.
• Knowledge of electronic thermal-management technologies is preferred.
• Familiarity with solid-state cooling, liquid cooling, single-phase cooling, or two-phase cooling is an advantage.
• Experience with materials preparation, processing, or device prototyping is desirable.
• Hands-on experience with analytical and characterization tools such as DSC, DMA, TGA, microscopy, thermal measurement systems, or related laboratory equipment.
• Experience with data analysis tools such as Excel, Python, MATLAB, Origin, or similar software is an advantage.
• Strong problem-solving ability and careful experimental working style.
• Good documentation skills and ability to work both independently and as part of a team.
• Excellent written and verbal communication skills in English; Chinese language skills are a strong plus.
• Ability to work safely and effectively in a laboratory R&D environment.

Internship Details
Internship period: 4–6 months
Expected start: November 2026
Location: Helsinki, Finland

Company Benefits
• Opportunity to contribute to challenging, industry-relevant R&D projects in advanced thermal management.
• Hands-on experience with material development, prototype testing, and laboratory characterization.
• Exposure to real business and technology challenges in next-generation electronic-device cooling.
• Dynamic and collaborative international R&D environment.
• Access to advanced research facilities, laboratory equipment, and technical mentoring.
• Networking opportunities with industry experts and researchers in electronics, materials, and next-generation technology development.

About Huawei

Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. With integrated solutions across four key domains – telecom networks, IT, smart devices, and cloud services – we are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.

At Huawei, innovation focuses on customer needs. We invest heavily in basic research, concentrating on technological breakthroughs that drive the world forward. We have 207,000 employees, and we operate in more than 170 countries and regions.

Huawei continues to invest in basic research and open innovation, and accommodates and addresses customer needs with an open mind, while steering these needs with science and technology. We have also built flexible business models and encourage numerous industries to adopt a vast range of models and applications. Through such initiatives, we are bringing digital to every person, home and organization for a fully connected, intelligent world.

We seek and reward talent! At Huawei, if you are dedicated to creativity, engagement of technical risks and delivery of target-driven results, your efforts will be rewarded with outstanding career prospects.

About Huawei Finland R&D

Huawei Finland Research Center was established in 2012. At our sites in Helsinki and Tampere, you will have an outstanding opportunity to be part of the leading research and development of future smart devices. We offer a career in a forward-looking industrial research team with a solid track record in innovation and publication and delivering its result as factual contributions to on-the-market devices.